Hurricane HY-A620
| HY-A620 | |
|---|---|
| Input Voltage | AC220V±10% 50/60HZ 1.5KW |
| Dimensions | 1030x1200x1600mm |
| Weight | About 700KG |
| Light Source | LED RGB Ring Light Source |
| Image Recognition | Outline recognition, color and grey analysis, image comparison |
| Camera | High grade imported digital color CCD camera 5m pixels |
| Resolution for X-Y axis | 15/20 um optional |
| MAX Warpage | 2% of PCB's diagonal or < 5mm |
| Inspection Window Size | FOV 30x20mm |
| MIN size available component | 0201/01005 |
| Special Feature | For precise defective marking (internal or external ink jet marking) |
| Software | |
|---|---|
| Operating System | Windows 7 or Above |
| Interface Languages | Chinese/English |
| Monitor | 22 inch color monitor |
| Detectable Solder Paste Defects | Missing, shifting, lack, too much, open/short, contamination, etc |
| Detectable Components Defects | missing, shifting, skewing, thumb up, side up, turn over, wrong (OCV), damage, reversing, soak solder, Glue squeeze-out, etc. |
| Detectable Soldering Defects | too much or too little solder paste, fake soldering, soldering bridging, contamination, etc. |
| NG indication | OK/NG marking, PCB ID, status, component name, status and failure picture, defective locations |
| Programming | Support general parts library and CAD data input |
| Analysis Output | Auto create SPC and data |
| Offline Programming | Support (CAD) |
Our User-Friendly Inline Automatic Optical Inspection Machine
The HY-A620 has specialized technologies that take automatic optical inspection to the next level. With outline recognition, color and grey analysis, and image comparison, its inspection capability is unparalleled.
This machine can be combined with other Hurricane machines to form our powerful Fully Automatic DIP Production Line. For more information on this efficient, highly recommended system, click here.
What is automatic optical inspection?
Automatic optical inspection (AOI) refers to automated visual inspection of a printed circuit board. In AOI, the camera scans the board for problems, whether catastrophic (such as a missing component), or quality defects (such as fillet size, shape, or component skew). It’s popular because it is a non-contact test method, and is used at many stages in the manufacturing process - bare board inspection, solder paste inspection (SPI), pre-reflow and post-reflow, and more. However, historically, it’s been used primarily after solder reflow as a post-production tool. This is because the machine can inspect for many types of defects at once, allowing faulty boards to be reworked, and the others sent to the next step.
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| Hardware | |
|---|---|
| Available PCB Size | 50mmx50mm ~ 400mmx350mm |
| PCB Thickness | ≤6mm |
| MAX PCB Weight | ≤3KG |
| MAX PCB Height | Above ≤85mm, bottom ≤35mm |
| PCB Holding Edge | ≥ 3.5mm |
| Working Height | Transfer track from ground: 900±20mm |
| Conveyor Speed | 750mm/s (MAX) |
| Conveyor Direction | Standard: left-right; Optional: right-left |
| Conveyor Control | Automatic |
| Working Parameters | |
|---|---|
| Positioning Accuracy | XYZ axis: ±0.01mm |
| Nozzle | ø3, 4, 5, 6, 8mm (Custom-Tailor) |
| Solder Volume | 15kg |
| MAX Solder Temperature | ≤350°C |
| Welding Method | Spot soldering & drag soldering |
| Accuracy | ±0.1mm |
| Soldering Time | 3-5 S/point |
| Nitrogen Source Requirement | 1.5-3CBM/h, Purity ≥99.998% |
| Air Supply | 5-7kg/cm2 |
| Wave Height | 0-7mm |
| MAX Warpage | 2% of PCB's diagonal or < 5mm |