Hurricane H-480i

Inspection System
Inspection Method	Color Processing，Matrix Image Differential Color Extract, Similarity, OCR, OCV
Camera	3CCD Camera ：20um, 15um, 10um; Configuration FOV : 20mm X 20mm
Light	Dome Lighting，Ultra Bright RGB or Optional RGBW LED
Chip Processing Speed	< 7ms
Image Processing Speed	< 120ms
Detectable Paste Defects	Misaligned, Overflow, Insufficient, Bridging, Stain
Detectable Component Defects	Missing, Misaligned, Skewed, Tombstone, Billboard, Overturned, Wrong Polarity, Wrong Part, Damaged, Lifted Leads, Extra Components.
Detectable Solder Defects	Solder Overflow, Solder less, Solder Bridging, No Solder, Cold Solder (RoHS Compliant）
Anti Static Measures	Anti Static Electric Outlet，Anti Static Wrist Strap

Mechanical System
PCB Inspectable Size	50×50mm ~ 330×480mm
PCB Thickness/Weight	0.5mm ~ 2.5mm / 3kg
PCB Warp Tolerance	< 2mm（Fixture Rectification)
Component Clearance	TOP < 25mm , BOT < 75 mm
Smallest Inspectable Component	0201” (0603mm) Optional : 01005”(0402mm) Chip
X,Y Platform Driver	AC Servo, Camera Movement X & Y
X,Y Platform Resolution	< 10um
X,Y Platform Movement Speed	< 700mm/sec

Software
Operating System	Microsoft Windows 7 Pro
Optional Software	Repair Station with SPC, Offline; Programming Software, Offline; Monitoring Software
Optional Accessory	1D/2D Handheld Barcode Reader
No. of Marks	2 Marks per PCB, 2 Sub Marks per Module of PCB
Mark Recognition Speed	0.5ms per Mark

Our User-Friendly Desktop Automatic Optical Inspection Machine

The H-480i has specialized technologies that take automatic optical inspection to the next level. This powerful machine can be easily implemented in any production line to keep your inspections fast and accurate. With matrix image difference modeling and color extraction analysis technology, the H-480i has a shorter debugging time, higher inspection speed, fewer errors, camera bar code recognition, skip mark detection, and much more.

What is automatic optical inspection?

Automatic optical inspection (AOI) refers to automated visual inspection of a printed circuit board. In AOI, the camera scans the board for problems, whether catastrophic (such as a missing component), or quality defects (such as fillet size, shape, or component skew). It’s popular because it is a non-contact test method, and is used at many stages in the manufacturing process - bare board inspection, solder paste inspection (SPI), pre-reflow and post-reflow, and more. However, historically, it’s been used primarily after solder reflow as a post-production tool. This is because the machine can inspect for many types of defects at once, allowing faulty boards to be reworked, and the others sent to the next step.