LP-8150MK2 5mm Precision Near Infrared Hot Plate

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LP-8150MK2
Light (heat) source Halogen lamp 15V 150W (with mirror)
Focal point distance 32mm
Focal point diameter 5mm
Focal point temperature Max about 850°C (calibrated with thermocouple)
Light (heat) output 150W (100 to 850°C) adjustable 10% to 100%
Irradiation time NORMAL START switch or REMOTE SWITCHING operation
Irradiation time TIMER 0.1 to 10 seconds interval (1 to 100 seconds with changeover)
Output control Wave form phase controlled by thyristor.
Remote switch A contact or transistor switch 5V 30mA.
Power supply AC100V/120V/220V/240V 150W 50/60Hz
External dimensions (W)230×(D)200×(H)300mm, about 6.5kg

Our Exclusive Light Beam Soldering Machine

Because of a comprehensive model change, functions and opperability of this model have been greatly improved. Using the quartz rod lens (sold separately), soldering small, specific areas in a semi-selective way is achievable.

Features

  • Near-infrared rays emitted by the 150W halogen lamp are collected by the reflecting mirror, which concentrates some 850 degrees C of heat at the focal point (a spot with a diameter of about 5mm).

  • No heating takes place outside the focal point. Because the light beam produces non-contact heating, it can be described as "clean heat".

  • Immediately on switching ON, within about 1 second soldering can be done within an area of 5mm diameter in the case of a printed circuit board (using cream solder on chip parts).

  • With the 4mm diameter quartz rod lens (sold separately), soldering can also be carried out inside small (5mm diameter) plastic bobbins (heat at point directly under the lens 450 degrees C).

  • Luminescence (heat) output can be adjusted from 30% to 100% of full power.

  • Lamp box is freely adjustable in the up-down, forward-backward directions, and can be easily installed on a robot arm, etc.

Applications

  • Soldering of chips for hybrid IC or SMT board, SOP-IC, LSI (using cream solder).

  • Dismounting of chip parts, SOP-ICs (8 - 16 pin) (using mask).

  • Removal of the mold from plastic mold ICs, LSI molds (using fuming nitric acid, the chip is perfectly exposed in about 10 minutes).

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