Easy to use, economically priced, power-saving, and conveniently compact, the RF-221 is one of our most highly recommended chip soldering machines.
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The micro screen µS-100series is metal mask for printing solder paste (solder cream) easily and securely in as many as 50 different patterns.
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The MP-7500 has several models to choose from to meet all of your manual mounting needs with high accuracy.
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With an improved new model, precise light beam soldering is possible with the LP-8150MK2.
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The HT-1800 is a high-precision hot plate developed for pre-heated or reflow soldering of SMT PC boards, and can be used in QFP, BGA repair work etc. With two independent hot plates, it's great for both preliminary heating and reflow heating of Hybrid IC boards and mini-SMT boards, as well as thermosetting of adhesives.
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Developed for pre-heated or reflow soldering, this is a easy-to-use, high-precision hot plate with a variety of applications, especially rework.
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The HT-1350 is an easy-to-use, high-precision hot plate developed for pre-heated or reflow soldering of SMT PC boards, and can be used in QFP, BGA repair work etc.
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The HD-6780 is specially designed for dispensing a fixed amount of solder paste on a variety of boards, and even functions as a vacuum pincette.
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Harnessing the power of saturated vapor zones, this reflow soldering machine allows for uniform and precise soldering.
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Heated by infrared technology, the RF-630’s heating section has 6 zones, allowing it to perform precise lead-free soldering despite its conveniently small, table-top structure.
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With its innovative use of infrared technology, hot air, and nitrogen, the RF-560 is able to meet the various requirements for lead-free soldering, all while being a useful medium size.
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The RF-460 is a conveniently small machine with serious technological chops. Fueled by nitrogen and infrared, this reflow solderer is capable of meeting the various requirements of lead-free soldering.
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Specially designed to utilize nitrogen gas, far-infrared, and convection, the RF-430 series comes in multiple models to meet your reflow soldering needs.
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The RF-250 is our solution to difficult boards requiring a high heat capacity. Using its 5-zone heating plate, even the most difficult boards can be soldered quickly with high precision.
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Capable of void-free soldering in a high vacuum environment (which can be seen through the observation window), the RF-210V is most often used for experiments, prototypes, and small lot production.
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The RF-110 and RF-110N2 are two of the most compact reflow soldering machines in the world. They are very well suited for trial manufacture, testing, and producing small quantities of multiple kinds of SMT board.
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The CTP-300U and CTP-600U are low-priced, easy to use devices that measure the temperature profile of both lead-free and high-temp soldering - and they do it in real time!
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With its extremely low price tag and ease of operation, even beginners can mount terminal solder balls using the BM-11.
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The BM-100V builds greatly on the applicability range of its predecessor, the BM-100. With its high-resolution CCD camera, it’s easy to position your work no matter the pattern.
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Whether you’re re-balling small quantities of reprocessed packages, mounting balls on chips that are under development, and much more, the BM-100 has got you covered. With a high degree of adjustability, it can be fitted to meet your needs.
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