RF-430 Nitrogen Reflow Soldering Machine Series
All Models | |
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Heating section | 4 zones, 980mm(L)x300mm(W)x50mm(H at inlet) |
Heating Method | far infrared rays |
Temperature control | P.I.D. temperature controller, Max 300°C |
Conveyor Method | SUS mesh belt, 300mm wide |
Conveyor Speed | 90 to 1400mm/min |
Direction | R → L or L → R (at user's request) |
Cooling | Forced cooling by a fan on the outlet side. |
Power supply | Single phase 200V About 6.7kW, Single phase 220V About 7.8kW |
Safety devices | Leak/Over-current breaker. Emergency stop switch. Alarm output (over/under temperature / heater disconnection). |
M1/IR | |
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Heating Gas | Atmosphere |
Convection | Natural convection |
External dimensions | (W)1600×(D)660×(H)560mm |
Weight | about 140kg |
M2/IRN2 | |
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Heating Gas | Nitrogen(N2) |
Convection | Natural convection |
External dimensions | (W)1600×(D)660×(H)560mm |
Weight | about 140kg |
M3/HA | |
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Heating Gas | Atmosphere |
Convection | Forced convection |
External dimensions | (W)1600×(D)660×(H)600mm |
Weight | about 180kg |
M4/HAN2 | |
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Heating Gas | Nitrogen(N2) |
Convection | Forced convection |
External dimensions | (W)1600×(D)660×(H)600mm |
Weight | about 180kg |
Our Series of Soldering Machines Using the Power of Convection and Nitrogen Gas
The RF-430 is a small reflow soldering machine based on far-infrared and air heat convection. It is designed specially for nitrogen gas (N2). Because this particular series is of the IR 4 zone type, it allows for a stable temperature profile.
Models
RF-430 Model-1/IR IR+Natural convection system
RF-430 Model-2/IRN2 IR+N2 system
RF-430 Model-3/HA IR+Hot air convection system
RF-430 Model-4/HAN2 IR+N2 convection system
Features
This is table top type N2 reflow soldering machine. (O2 density : about 5000ppm)
The heating source is IR and hot air heat convection, consisting of 4 zone heating sections.
In future you can modify the basic model to the model applicable to N2. (with manufacturer's assistance)
Applicable Circuit Boards
Dimensions: 15mm×15mm to 300mm×300mm
Board thickness: 0.1mm to 2mm
Height: Max. 50mm
Applications
Reflow soldering of H-IC and SMT circuit boards.
Reflow soldering for non-cleanse type cream soldering. (Model-2/4)
Drying of thermosetting adhesives and other heating work.
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