RF-210V High Vacuum Reflow Soldering
| RF-210V | |
|---|---|
| Heating Zone | 1 zone, 150mm×150mm |
| Heating Method | Direct heating from Hotplate underneath Work |
| Max Temperature | 400°C |
| Cooling Zone | 1 zone, 150mm×150mm |
| Cooling Method | Direct cooling from Cooling Plate underneath Work |
| Conveyor | Carrier Bar(Push Work by Metal) system or 0.125mmt Teflon Sheet (or 30µmt SUS304 Sheet) carrier system |
| Vacuum Source | Vacuum Pump : Max -98kPa(G) |
| Vacuum | -95kPa(G) Time required; 150 sec. (Vacuum from atmosphere) |
| Chamber Size | (L)395×(W)340×(H)105mm |
| Chamber Work Area | (L)300×(W)150×(H)55mm |
| Observation Window | 105φ(Reflow part) |
| Compatible Gas | Gas Atmosphere Soldering : N2 or N2+H2(3-4%) |
| Control | Touch Panel type Sequencer |
| Sensor Terminal | Sensors for Temperature profile measurement terminal. 3CH |
| Safety | Breaker for Leakage/Over current, Emergency Stop Switch |
| Power source | Single phase 200V/220V/240V 1.5kW 50/60Hz |
| External dimensions | (W)600×(D)800×(H)860mm |
| Weight | about 135kg |
Our High Vacuum Reflow Soldering Solution
The RF-210V allows soldering in a high vacuum environment. This low-cost vacuum reflow machine is most often used for experiments, prototypes, or small lot production. It is able to perform void-free soldering
Features
Reflow soldering in under -95kPa G super-high vacuum environment
Compatible to Maximum 400°C 150mm × 150mm Work
This is 2 Zone by 1 Hotplate heating zone, 1 Cooling zone type vacuum soldering unit
Able to use Nitrogen(N2) and Green Gas(Soldering in Gas Atmosphere)
Able to see while soldering in vacuum environment from observation window
Compatible Work
Max(W)150×(L)150×(H)50mm, Max300g
Metal or Ceramics with flat bottom
Intended Use
Tight bonding for Power semiconductor
Reflow Soldering for Power module
Soldering for Solar cell
Reflow Soldering for Metallic substrate
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