BM-100 Solder Ball Terminal Machine

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Specifications

BM-100
Fine-adjustment of X,Y,Z 15mm (10µm steps)
Air input 2 to 5kgf/cm2
Hose OD6mmφ×ID4mm&phi
Power supply AC120V or 220V 100VA 50/60Hz
Main unit size (W)240×(D)225×(H)410mm, 10kg
Control box size (W)180×(D)250×(H)110mm, 3kg


µS-100 series (optional)
Size 14×28mm to 54×63mm (7 kinds)
Thickness 0.15mm or 0.13mm
Frame Material SPCC
Screen Material SUS304


Applicable Package
Size From 6x6 to 50x50mm
Number of Pins from 48 to 1,500 pins
Pitch 1.5 mm ti 0.5mm
Ball Diameter 0.89mmØ to 0.4mmØ
Solering Ball 183°C, 290°C

Our Highly Applicable Ball Terminal Mounting Device

The BM-100 with MICRO SCREEN (μS-100 series, option) is a machine for mounting ball terminals on BGA, CSP, MCM and other packages. Its applicability ranges from CSP with 48 pins to MCM with 1,500 pins, for balls
with a diameter of 0.4mmØ to 0.89mmØ. This machine makes it easy to mount ball terminals in a myriad of scenarios, whether you’re re-balling small quantities of reprocessed packages, mounting balls on chips that are under development, and much more.

Features

  • Application range from CSP with 48 pins to BGA and MCM with 1,500 pins for balls with a diameter of 0.4mmØ to 0.89mmØ. (MICRO SCREEN is optional)

  • Flux/cream solder printing and ball aligning are possible with this single machine. (The screen for cream printing and the screen for ball aligning has to be arranged for by the user.)

  • The screen position (X, Y, Z) can be fine-adjusted with 10μm accuracy based on the micro meter.

  • Fixation of the chip adsorption and the screen vertical movement are controlled automatically with the operating switch.

  • It is possible to carry out reflow-soldering immediately after ball alignment; a manual-type N2 reflow machine RF-110N2 is also available. (Reflow jig for high temperature (290°C) solder ball can be also arranged for.)

Additional Options

  • Micro Screen μS-100series

  • Manual reflow soldering equipment RF-110/RF-110N2

  • Chip adsorption Stage Special order

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Japan Pulse Laboratories, Ball Mount Soldering, Reflow SolderingGuest UserBall Mount Equipment