BM-100V Solder Ball Mount Machine
BM100V | |
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Fine-adjustment of X,Y,Z | 15mm (10µm steps) |
Air input | 2 to 5kgf/cm2 |
Hose | OD6mmφ×ID4mm&phi |
Power supply | AC120V or 220V 100VA 50/60Hz |
Main unit size | (W)240×(D)325×(H)580mm 12kg |
Control box size | (W)180×(D)250×(H)110mm 3kg |
CCD camera | 350,000 pixels, 1/2 inch |
Display magnification | 5.8× to 17.8× zoom |
Monitor | 13inch LCD monitor |
µS-100 series (optional) | |
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Size | 14×28mm to 54×63mm (7 kinds) |
Thickness | 0.15mm or 0.13mm |
Frame Material | SPCC |
Screen Material | SUS304 |
Our Most Versatile Ball Mounting Device
The BM-100V is machine for mounting ball terminals on BGA, CSP, MCM and other packages by using a microscreen (option). lts applicability ranges from CSP with 30 pins to MCM with 3,000 pins for balls with a diameter of 0.28mmφ to 0.89mmφ. This machine makes it easy to mount ball terminals in a myriad of scenarios, whether you’re re-balling small quantities of reprocessed packages, mounting balls on chips that are under development, and much more.
Features
Application range from CSP with 30 pins to BGA and MCM with 3,000 pins for balls with a diameter of 0.28mmφ to 0.89mmφ. (Depending on a microscreen selected for use with a package. The microscreen is optional.)
Flux/cream solder printing and ball mounting are possible with this single machine. (Both the screen for cream printing and the screen for ball aligning these devices are necessary.)
The screen position (X, Y, Z) can be fine-adjusted with 10µm accuracy based on the micro meter.
Fixation of the package and the screen vertical movement are controlled automatically with the opereting switch.
It is possible to carry out reflow-soldering immediately after ball alignment; a manual-type N2reflow machine RF-110N2 is also available.
The high resolution CCD camera with a zoom lens allows an easy positioning of the screen and the work. With the 5.8× to 17.8× zoom it is easy to handle positioning of packages even with large and microscopic patterns.
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