SP-100 Solder Paste Printer For LSI, QFP, BGA, and More
| SP-100 | |
|---|---|
| X-Y fine adjustment | 15mm (resolution 10µm) |
| Applicable circuit board size | 10×10mm to 250×300mm |
| Applicable circuit board thickness | 0.125 to 40mm |
| External dimensions | (W)250×(L)450×(H)160mm |
| Weight | about 8kg |
| Accessories | squeegee (SUS304) 4pcs (SQ-10, SQ-25, SQ-35, SQ-45) |
| µS-100series (option) | |
|---|---|
| Size | 14×28mm to 54×63mm (7 kinds) |
| Thickness | 0.15mm or 0.13mm |
| Frame Material | SPCC |
| Screen Material | SUS304 |
Our Precise, Easy-to-use Screen Printer
Model SP-100 is a printer to be used in combination with Micro Screen (µS-100series, option) for applying solder paste (solder cream) to single LSI such as QFP and BGA. With the SP-100, you can apply solder paste to PC board by PC board repeatedly with ease and with high precision. (Please see the data on the Micro Screen µS-100 series in conjunction with this machine.)
Features
Easy positioning of screen(mask) and work piece. As micrometers are fitted onto X-Y axis as standard machine parts, fine adjustment of accuracy 10µm is possible.
By dint of high precision, solder paste can precisely be applied to QFP IC's with fine pitch such as 0.4mm pitch and 0.5mm pitch even in repeated printing.
Micro Screens are available and replaceable just by loosening 2 screw.
Use of PC board holder type PH-100 makes it easier to apply solder paste in rework of dual SMT-PC board. PH-100 is available as an optional item.
Also with the screen for BGA/CSP reballing, BGA and CSP can easily be reballed.
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