SP-100BR
| SP-100 | |
|---|---|
| Fine-adjustment of X,Y,Z | 15mm (10µm steps) |
| Power supply | AC120V or 220V 10VA 50/60Hz |
| Main unit dimensions | (W)250×(D)450×(H)160mm, 8kg |
| Control box dimensions | (W)170×(D)220×(H)110mm, 2kg |
| µS-100series (option) | |
|---|---|
| Size | 14×28mm to 54×63mm (7 kinds) |
| Thickness | 0.15mm or 0.13mm |
| Frame Material | SPCC |
| Screen Material | SUS304 |
Our Highly Applicable Reballing System Screen
The SP-100BR is machine for mounting ball terminals on BGA, CSP, MCM and other packages by using a microscreen (µS-100series, option). lts applicability ranges from CSP with 30 pins to MCM with 3,000 pins for balls with a diameter of 0.28mmφ to 0.89mmφ. With the machine it is easy to mount ball terminals on a small quantity of packages when reballing on reprocessed packages, or when mounting balls on newly developed chips, etc.
Features
Application range from CSP with 30 pins to BGA and MCM with 3,000 pins for balls with a diameter of 0.28mmφ to 0.89mmφ. (Depending on a microscreen selected for use with a package. The microscreen is optional.)
Flux/cream solder printing and ball mounting are possible with this single machine. (Both the screen for cream printing and the screen for ball aligning these devices are necessary.)
The screen position (X, Y, Z) can be fine-adjusted with 10µm accuracy based on the micro meter.
It is possible to carry out reflow-soldering immediately after ball alignment; a manual-type N2reflow machine RF-110N2 is also available.
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